| 摘要 |
Disclosed are a sub-mount used for an LED, an LED chip, and a method of manufacturing the LED chip. According to an embodiment of the present invention, the sub-mount for LED includes: a substrate; and a bump which is formed on the upper part of the substrate and is coupled with to electrodes of the LED by a photolithography process, wherein the bump is provided in multiple layers reflecting light which is emitted by the LED. |
