Method for activating a copper surface for electroless plating

摘要

The present invention relates to method for activating a copper or copper alloy surface for depositing a metal or metal alloy layer by electroless (autocatalytic) plating thereon wherein the formation of undesired voids is suppressed. The copper or copper alloy surface is contacted with palladium ions, at least one phosphonate compound and halide ions followed by electroless (autocatalytic) deposition of a metal such as palladium or a metal alloy such as a Ni-P alloy.