PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE HAVING THE SAME AND METHOD FOR MANUFACTURING THE SAME

摘要

A printed circuit board, a semiconductor package having the same and a method for manufacturing the same are provided. According to an embodiment of the present invention, provided is a semiconductor package comprising: a printed circuit board which includes an insulating substrate, a first circuit pattern formed on one surface of the insulating substrate, and a second circuit pattern formed on the other surface of the insulating substrate, and is formed so that the second circuit pattern has a thickness thinner than that of the first circuit pattern to generate bending toward a side surface of the insulating substrate as the temperature rises; and a semiconductor chip mounted on one surface or the other surface of the printed circuit board, and formed to generate convex or concave bending toward the printed circuit board as the temperature rises. By interaction between the bending of the printed circuit board and the bending of the semiconductor chip as the temperature rises, a direction and a degree of the bending can be determined.