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发明名称
雷射加工装置及雷射加工方法
摘要
本发明提供一种雷射加工装置以及雷射加工方法,该雷射加工装置即使在脉冲宽度较短时,亦能够使每个脉冲的脉冲能量稳定。雷射光源与从外部接收之雷射振荡开始触发同步开始进行雷射振荡,并与雷射振荡停止触发同步停止雷射振荡。检测器检测取决于对雷射光源施加之电力以及从雷射光源射出之雷射脉冲的至少一方之物理量。控制装置对雷射光源施加雷射振荡开始触发,并且根据检测器所检测之物理量的检测结果,对雷射光源施加振荡停止触发。
申请公布号
TW201438361
申请公布日期
2014.10.01
申请号
TW103106477
申请日期
2014.02.26
申请人
住友重机械工业股份有限公司
发明人
万雅史;冈田康弘
分类号
H01S3/131(2006.01);H01S3/11(2006.01)
主分类号
H01S3/131(2006.01)
代理机构
代理人
<name>林志刚</name>
主权项
地址
日本
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