| 摘要 |
Embodiments of the present invention provide an electronic module and a packaging structure of the electronic module. The electronic module includes: a substrate; at least one electronic component, arranged on an upper surface of the substrate; and a first conductive part and a second conductive part, configured to connect the electronic module to an external printed circuit board; the first conductive part is arranged at a lower surface of the substrate and is electrically connected to the electronic component; and the second conductive part is arranged across a lateral surface of the substrate and the lower surface of the substrate. The electronic module is packaged with the printed circuit board by arranging a second conductive part across the lateral surface of the substrate and the lower surface of the substrate, which improves the quality of welding between the electronic module and the printed circuit board. |
