Substrate damage prevention system and method

摘要

A substrate damage prevention system and method for a plasma treating apparatus are provided. The system may include a lower electrode on which a substrate may be mounted, an inert gas supply unit which may supply an inert gas to an upper surface of the lower electrode on which the substrate is mounted, and an air supply unit which may supply air to the upper surface of the lower electrode. An inert gas may be supplied between the lower electrode and the substrate in order to control the temperature of the substrate during the chucking. Air may be supplied between the lower electrode and the substrate during dechucking in order to allow the substrate to be easily separated from the lower electrode.

主权项

1. A substrate handling device, comprising:
an electrode positioned in a chamber and configured to receive a substrate for processing, the electrode comprising:
a base layer;an insulation layer provided on the base layer;a cooling layer provided on the insulation layer; anda lower electrode portion provided on the cooling layer; a gas passage panel positioned on a top surface of the electrode, a top surface of the gas passage panel having a groove pattern formed therein, facing a bottom surface of a substrate received on the electrode; a plurality of lift pins that penetrate through the electrode such that upper ends of the plurality of lift pins are configured to contact the bottom surface of the substrate so as to support the substrate thereon, wherein the bottom surface of the substrate contacts only the upper ends of the plurality of lift pins; an inert gas supplier to selectively supply an inert gas to a gap formed between the groove pattern formed on the gas passage panel and the bottom surface of the substrate positioned only on the upper ends of the plurality of lift pins, wherein the gap is sealed by a chucking operation; and an air supplier to selectively supply air to the sealed gap formed during chucking between the gas passage panel and the bottom surface of the substrate, wherein the air supplied to the gap during a de-chucking operation applies a predetermined air pressure to the substrate to exert a force against the substrate for releasing the seal formed during the chucking operation and separating the substrate from the lower electrode.