Method of manufacturing a hollow surface mount type electronic component

摘要

A method of manufacturing a hollow surface mount type electronic component has a preparing step, a gluing step and a cutting step. The preparing step includes preparing a baseboard, a clapboard and a cover board, mounting multiple circuit segments and conducting points on two opposite faces of the baseboard at intervals and boring multiple through holes on the clapboard corresponding to the circuit segments. The gluing step includes mounting multiple electronic elements on the baseboard to connected with the circuit segments, gelatinizing glue on the boards to mount the clapboard between the baseboard and the cover board and pressing the boards by a pressing machine. The cutting step includes cutting the boards by a cutting machine to produce multiple single SDM electronic components.

主权项

1. A method of manufacturing a hollow surface mount type electronic component comprising:
a preparing step comprising:
preparing a baseboard, a clapboard and a cover board;cleaning and drying the baseboard, the clapboard and the cover board;mounting multiple circuit segments on a top face of the baseboard at intervals;mounting multiple conducting points on a bottom face of the baseboard at intervals and the conducting points connected to the circuit segments;marking multiple cutting lines on the bottom face of the baseboard around the conducting points; andforming multiple through holes on the clapboard corresponding to the circuit segments on the baseboard to mount a rib between each pair of adjacent through holes on a center line between two adjacent conducting points on the baseboard, and the center line between two adjacent conducting points aligning with one of the cutting lines; a gluing step comprising:
gelatinizing a first glue on a bottom face of the clapboard and the top face of the baseboard;mounting the bottom face of the clapboard on the top face of the baseboard to mount each circuit segment in one of the through holes of the clapboard;putting the combined clapboard and baseboard in a pressing machine to press the clapboard with the baseboard;mounting multiple electronic elements on the baseboard to connect with the circuit segments via the through holes of the clapboard after pressing the clapboard with the baseboard;gelatinizing a second glue on a bottom face of the cover board and a top face of the clapboard;mounting the bottom face of the cover board on the top face of the clapboard; andpressing the baseboard, the clapboard and the cover board in the pressing machine to make the cover board and the baseboard securely and respectively mounted on the top face and the bottom faces of the clapboard; and a cutting step comprising:
forming multiple positioning holes in corners of the baseboard, the clapboard and the cover board;putting the baseboard, the clapboard and the cover board on a positioning seat of a cutting machine;cutting the baseboard, the clapboard and the cover board along the cutting lines on the bottom face of the baseboard by the cutting machine to produce multiple single SDM electronic components.