SEMICONDUCTOR PACKAGE HAVING POWER INTEGRITY METAL LINE STRUCTURE PREVENTING WARPAGE FUNCTION AND A METHOD FOR PRODUCTION THEREOF

摘要

The present invention relates to a semiconductor package on package (PoP) stack package having a metal wire connection structure having power stabilization and distortion prevention function. The semiconductor PoP package of the present invention can obtain a PoP semiconductor device package with power stabilization and distortion prevention by electrically connecting a upper semiconductor chip and a lower semiconductor chip by using metal wire bar or via of a metal wire form having the power stabilization function of a power line and a ground line and distortion prevention function.