| 发明名称 | Apparatus and methods for through substrate via test | ||
| 摘要 | A stack of vertically-connected, horizontally-oriented integrated circuits (ICs) may have electrical connections from the front side of one IC to the back side of another IC. Electrical signals may be transferred from the back side of one IC to the front side of the same IC by means of through substrate vias (TSVs), which may include through silicon vias. Electronic apparatus, systems, and methods may operate to test and/or replace defective TSVs. Additional apparatus, systems and methods are disclosed. | ||
| 申请公布号 | US8847619(B2) | 申请公布日期 | 2014.09.30 |
| 申请号 | US201113179247 | 申请日期 | 2011.07.08 |
| 申请人 | Micron Technology, Inc. | 发明人 | Hargan Ebrahim H;Bunker Layne;Dimitriu Dragos;King Gregory |
| 分类号 | G01R31/02;H01L21/66;G11C29/00;G11C29/02;G01R31/28;G11C29/50 | 主分类号 | G01R31/02 |
| 代理机构 | Schwegman Lundberg & Woessner, P.A. | 代理人 | Schwegman Lundberg & Woessner, P.A. |
| 主权项 | 1. A method of testing a stack of interconnected electronic devices, comprising: comparing a voltage drop caused by imposition of a repeating signal from a ring oscillator circuit and a current from a current source across a termination resistor and a sum of a resistance formed by a series connected electrical path between an input/output connection on one of a plurality of electronic devices included in the stack and an input/output connection on another one of the plurality of electronic devices included in the stack to determine a quality of the series connected electrical path in the stack, wherein the ring oscillator circuit forms a part of one of the plurality of electronic devices. | ||
| 地址 | Boise ID US | ||