| 发明名称 | Robust joint structure for flip-chip bonding | ||
| 摘要 | An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a copper bump at a main surface of the first work piece and having a first dimension; and a nickel-containing barrier layer over and adjoining the copper bump. The second work piece is bonded to the first work piece and includes a bond pad at a main surface of the second work piece; and a solder mask at the main surface of the second work piece and having a solder resist opening with a second dimension exposing a portion of the bond pad. A ratio of the first dimension to the second dimension is greater than about 1. Further, a solder region electrically connects the copper bump to the bond pad, with a vertical distance between the bond pad and the copper bump being greater than about 30 μm. | ||
| 申请公布号 | US8847387(B2) | 申请公布日期 | 2014.09.30 |
| 申请号 | US201012842304 | 申请日期 | 2010.07.23 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Hsiao Ching-Wen;Chuang Yao-Chun;Chen Chen-Shien;Kuo Chen-Cheng;Huang Ru-Ying |
| 分类号 | H01L23/48;H01L23/00;H01L23/498 | 主分类号 | H01L23/48 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. An integrated circuit structure comprising: a first work piece comprising: an under bump metallurgy (UBM) at a main surface of the first work piece;a copper bump over the UBM and having a first dimension in a first plane parallel to the main surface of the first work piece; anda nickel-containing barrier layer over and adjoining the copper bump; a second work piece bonded to the first work piece and comprising: a bond pad at a main surface of the second work piece; anda solder mask at the main surface of the second work piece and having a solder resist opening with a second dimension exposing a portion of the bond pad, wherein the second dimension is measured in a second plane parallel to the main surface of the second work piece, and wherein a ratio of the first dimension to the second dimension is greater than about 1; and a solder region electrically connecting the copper bump to the bond pad, wherein the solder region contacts a surface of the nickel-containing barrier layer facing the second work piece to form an interface, and substantially does not contact sidewalls of the copper bump, wherein the interface has a dimension substantially equal to the first dimension. | ||
| 地址 | Hsin-Chu TW | ||