发明名称 |
Dielectric charge-trapping materials having doped metal sites |
摘要 |
Dielectric materials having implanted metal sites and methods of their fabrication have been described. Such materials are suitable for use as charge-trapping nodes of non-volatile memory cells for memory devices. By incorporating metal sites into dielectric charge-trapping materials using an ammonia plasma and a metal source in contact with the plasma, improved programming and erase voltages may be facilitated. |
申请公布号 |
US8846516(B2) |
申请公布日期 |
2014.09.30 |
申请号 |
US200711774298 |
申请日期 |
2007.07.06 |
申请人 |
Micron Technology, Inc. |
发明人 |
Ramaswamy Nirmal |
分类号 |
H01L21/4763;H01L29/423;B82Y10/00;H01L21/28 |
主分类号 |
H01L21/4763 |
代理机构 |
Dicke, Billig & Czaja, PLLC |
代理人 |
Dicke, Billig & Czaja, PLLC |
主权项 |
1. A method of forming a memory cell, comprising:
forming a gate dielectric over an active area of a semiconductor substrate; forming a dielectric charge-trapping material over the gate dielectric; generating a plasma from component gases comprising at least ammonia, nitrogen, argon, helium, or hydrogen; contacting the plasma concurrently with a solid metal source and a surface of the dielectric charge-trapping material, thereby implanting metal sites from the solid metal source into the surface of the dielectric charge-trapping material; forming an intergate dielectric over the dielectric charge-trapping material after implanting the metal sites into the surface of the dielectric charge-trapping material; and forming a control gate over the intergate dielectric. |
地址 |
Boise ID US |