发明名称 Dielectric charge-trapping materials having doped metal sites
摘要 Dielectric materials having implanted metal sites and methods of their fabrication have been described. Such materials are suitable for use as charge-trapping nodes of non-volatile memory cells for memory devices. By incorporating metal sites into dielectric charge-trapping materials using an ammonia plasma and a metal source in contact with the plasma, improved programming and erase voltages may be facilitated.
申请公布号 US8846516(B2) 申请公布日期 2014.09.30
申请号 US200711774298 申请日期 2007.07.06
申请人 Micron Technology, Inc. 发明人 Ramaswamy Nirmal
分类号 H01L21/4763;H01L29/423;B82Y10/00;H01L21/28 主分类号 H01L21/4763
代理机构 Dicke, Billig & Czaja, PLLC 代理人 Dicke, Billig & Czaja, PLLC
主权项 1. A method of forming a memory cell, comprising: forming a gate dielectric over an active area of a semiconductor substrate; forming a dielectric charge-trapping material over the gate dielectric; generating a plasma from component gases comprising at least ammonia, nitrogen, argon, helium, or hydrogen; contacting the plasma concurrently with a solid metal source and a surface of the dielectric charge-trapping material, thereby implanting metal sites from the solid metal source into the surface of the dielectric charge-trapping material; forming an intergate dielectric over the dielectric charge-trapping material after implanting the metal sites into the surface of the dielectric charge-trapping material; and forming a control gate over the intergate dielectric.
地址 Boise ID US