发明名称 |
Method of decomposable checking approach for mask alignment in multiple patterning |
摘要 |
The present disclosure provides one embodiment of an integrated circuit (IC) design method. The method includes receiving an IC design layout having a first plurality of features defined in a first layer and a second plurality of features defined in a second layer; converting the IC design layout to a topological diagram having nodes, chains and arrows; and identifying alignment conflict based on the topological diagram using rules associated with loop and path count. |
申请公布号 |
US8850367(B2) |
申请公布日期 |
2014.09.30 |
申请号 |
US201313732855 |
申请日期 |
2013.01.02 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lai Chih-Ming;Hsieh Ken-Hsien;Huang Wen-Chun;Liu Ru-Gun |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A method comprising:
receiving an integrated circuit (IC) design layout having a first plurality of features defined in a first layer and a second plurality of features defined in a second layer, wherein the first layer corresponds to a first material layer, and wherein the second layer corresponds to a second material layer; converting, by a computer system, the IC design layout to a topological diagram having nodes, chains and arrows; and identifying alignment conflict based on the topological diagram using rules associated with loop and path count, wherein in the topological diagram an arrow represents a mask alignment relation between two features in the first and second layers, respectively, and links the two features. |
地址 |
Hsin-Chu TW |