发明名称 |
Nanotube-based fluid interface material and approach |
摘要 |
A thermal interface material facilitates heat transfer between an integrated circuit device and a thermally conductive device. According to an example embodiment, a thermal interface material includes carbon nanotube material that enhances the thermal conductivity thereof The interface material flows between an integrated circuit device and a thermally conductive device. The carbon nanotube material conducts heat from the integrated circuit device to the thermally conductive device. |
申请公布号 |
US8848372(B2) |
申请公布日期 |
2014.09.30 |
申请号 |
US200511718714 |
申请日期 |
2005.11.04 |
申请人 |
NXP B.V. |
发明人 |
Wyland Chris;Thoonen Hendrikus Johannes Jacobus |
分类号 |
H05K7/20;F28F7/00;H01L23/34;H01L23/373;C09K5/10;B82Y10/00 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
1. An integrated circuit chip arrangement comprising:
an integrated circuit chip; a thermally conductive device adjacent the integrated circuit chip; and an interface region immediately adjacent the integrated circuit chip, the interface region including carbon nanotube material in a fluid mixture, the carbon nanotube material configured and arranged with the fluid mixture to thermally couple heat between the integrated circuit chip and the thermally conductive device. |
地址 |
Eindhoven NL |