发明名称 Nanotube-based fluid interface material and approach
摘要 A thermal interface material facilitates heat transfer between an integrated circuit device and a thermally conductive device. According to an example embodiment, a thermal interface material includes carbon nanotube material that enhances the thermal conductivity thereof The interface material flows between an integrated circuit device and a thermally conductive device. The carbon nanotube material conducts heat from the integrated circuit device to the thermally conductive device.
申请公布号 US8848372(B2) 申请公布日期 2014.09.30
申请号 US200511718714 申请日期 2005.11.04
申请人 NXP B.V. 发明人 Wyland Chris;Thoonen Hendrikus Johannes Jacobus
分类号 H05K7/20;F28F7/00;H01L23/34;H01L23/373;C09K5/10;B82Y10/00 主分类号 H05K7/20
代理机构 代理人
主权项 1. An integrated circuit chip arrangement comprising: an integrated circuit chip; a thermally conductive device adjacent the integrated circuit chip; and an interface region immediately adjacent the integrated circuit chip, the interface region including carbon nanotube material in a fluid mixture, the carbon nanotube material configured and arranged with the fluid mixture to thermally couple heat between the integrated circuit chip and the thermally conductive device.
地址 Eindhoven NL