发明名称 Dimensionally tolerant multiband conformal antenna arrays
摘要 Some embodiments relate to a multiband antenna array formed on a flexible substrate. Low frequency antenna elements may be formed using nanoink. High frequency elements may be provided on a prefabricated antenna chip. The antenna array may be heated in a low temperature oven to sinter the nanoink into a solid antenna element. In some embodiments, an adhesive insulation layer may be provided which allows the antenna array to be attached to any surface. In other embodiments, the antenna array may be embedded in a composite material.
申请公布号 US8847823(B2) 申请公布日期 2014.09.30
申请号 US201213346305 申请日期 2012.01.09
申请人 Lockheed Martin Corporation 发明人 Vos David L.;Baldwin Carl;Darling David R.;Kaplun Brian;Dorough David R.
分类号 H01Q1/38 主分类号 H01Q1/38
代理机构 Wolf, Greenfield & Sacks, P.C. 代理人 Wolf, Greenfield & Sacks, P.C.
主权项 1. A multiband antenna array comprising: a flexible substrate comprising a first flexible surface and a second flexible surface opposed to the first flexible surface; and a plurality of high frequency antenna chips, each high frequency antenna chip comprising: an inflexible substrate comprising a first inflexible surface and a second inflexible surface opposed to the first inflexible surface;at least one high frequency antenna element in contact with the first inflexible surface of the inflexible substrate; and at least one low frequency antenna element in contact with the first flexible surface of the flexible substrate, wherein the at least one low frequency antenna element comprises sintered nanoink.
地址 Bethesda MD US
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