Semiconductor light-emitting device

摘要

A semiconductor light emitting device (A) includes an elongated substrate (1) formed with a through-hole (11), a first, a second and a third semiconductor light emitting elements (3R, 3G, 3B) mounted on the main surface of the substrate (1), and an electrode (2R) electrically connected to the first semiconductor light emitting element (3R) and extending to the reverse surface of the substrate (1) via the through-hole (11). The first semiconductor light emitting element (3R) and the through-hole (11) are positioned between the second semiconductor light emitting element (3G) and the third semiconductor light emitting element (3B) in the longitudinal direction of the substrate (1). The second semiconductor light emitting element (3G) is arranged closer to one end of the substrate (1), whereas the third semiconductor light emitting element (3B) is arranged closer to the other end of the substrate (1).

主权项

1. A side-view type semiconductor light emitting device comprising:
an elongated substrate including a main surface in a form of an elongated rectangle, a reverse surface opposite to the main surface, a mount surface extending between the main surface and the reverse surface, a flat surface opposite to the mount surface and extending between the main surface and the reverse surface, a first end surface and a second end surface spaced from each other in a longitudinal direction of the substrate, and a through-hole extending from the main surface to the reverse surface; a first, a second and a third semiconductor light emitting elements mounted on the main surface of the substrate; and an electrode electrically connected to the first semiconductor light emitting element and extending to the reverse surface of the substrate via the through-hole; wherein the first semiconductor light emitting element and the through-hole are positioned between the second semiconductor light emitting element and the third semiconductor light emitting element in the longitudinal direction of the substrate, the second semiconductor light emitting element is arranged closer to the first end surface of the substrate, and the third semiconductor light emitting element is arranged closer to the second end surface of the substrate, wherein the mount surface of the substrate is provided with a plurality of surface-mount electrodes each extending from the main surface to the reverse surface, wherein the main surface of the substrate is provided with a common electrode connected to the first, the second and the third semiconductor light emitting elements, respectively, via wires, the common electrode including two pads spaced apart from each other in the longitudinal direction of the substrate, wherein the first semiconductor light emitting element is disposed between the two pads in the longitudinal direction of the substrate, and wherein the flat surface extends from the first end surface to the second end surface of the substrate.