| 发明名称 |
Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package |
| 摘要 |
A chip arrangement is provided, the chip arrangement including: a first chip carrier; a second chip carrier; a first chip electrically connected to the first chip carrier; a second chip disposed over the first chip carrier and electrically insulated from the first chip carrier; and a third chip electrically connected to the second chip carrier; wherein at least one of the first chip and the second chip is electrically connected to the third chip. |
| 申请公布号 |
US8847385(B2) |
申请公布日期 |
2014.09.30 |
| 申请号 |
US201213430726 |
申请日期 |
2012.03.27 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Mahler Joachim;Wombacher Ralf;Prueckl Anton |
| 分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip arrangement, comprising:
a first chip carrier; a second chip carrier; a first chip electrically connected to the first chip carrier; a second chip disposed over the first chip carrier and electrically insulated from the first chip carrier; and a third chip electrically connected to the second chip carrier; wherein at least one of the first chip and the second chip is electrically connected to the third chip; and wherein at least one of the first chip carrier and the second chip carrier comprises a material comprising a roughness ranging from about 1 nm to 1000 nm. |
| 地址 |
Neubiberg DE |
