Light emitting device package

摘要

A light emitting device package and a method for manufacturing the same are provided. The light emitting device package comprises a package body comprising a cavity at an upper portion; a first and second metal layers on the cavity of the package body; an open area recessed in the cavity; a first metal plate disposed in the open area and spaced apart from the first and second metal layers; a semiconductor device disposed on the first metal plate and electrically connected to at least one of the first and the second metal layers; and a resin material in the cavity.

主权项

1. A light emitting device package, comprising:
a body comprising a cavity at an upper portion; first and second metal layers in the cavity of the body; an open area recessed in the cavity and disposed between the first and second metal layers; a first metal plate disposed in the open area and spaced apart from the first and second metal layers; a semiconductor device disposed on the first metal plate and electrically connected to at least one of the first and the second metal layers; a resin material in the cavity; and a second metal plate disposed under a bottom surface of the body, wherein the first metal plate is disposed between the body and the semiconductor device, and between the first and second metal layers, wherein a first portion of the body is disposed between the first metal plate and the second metal plate, and wherein the second metal plate has a horizontal width smaller than a horizontal width of the body and is vertically overlapped with the first and second metal layers disposed in the cavity.