Electronic device and speed-up booting module and method thereof using heat pipes

摘要

A speed-up booting module of an electronic device includes a first heat pipe with two ends connected to a first component and a second component respectively, and the first heat pipe including a first working fluid, wherein when a booting process is performed at a first environmental temperature, the heat from the first component in operation is transferred to the second component so that a temperature of the second component reaches an operating temperature; and a second heat pipe with two ends connected to the first component and a third component respectively, and the second heat pipe including a second working fluid, a boiling point of the second working fluid is higher than the boiling point of the first working fluid; wherein at a second environmental temperature, a temperature of the second component reaches the boiling point, the heat from the first component is transferred to the second component.

主权项

1. A speed-up booting module of an electronic device, comprising:
a first heat pipe, comprising a hot end connected to a first component; a cold end connected to a second component; and a first working fluid; wherein when a booting process is performed at a first environmental temperature, the first environmental temperature is higher than or equal to a boiling point of the first working fluid, the heat from the first component in operation is transferred to the second component, so that a temperature of the second component reaches an operating temperature of the second component; and a second heat pipe, comprising a hot end connected to the first component; a cold end connected to a third component; and a second working fluid, a boiling point of the second working fluid of the second heat pipe being higher than the boiling point of the first working fluid of the first heat pipe; wherein at a second environmental temperature, a temperature of the second working fluid reaches a boiling point of the second working fluid, the heat from the first component in operation is transferred heat to the third component.