Vacuum lamination system and vacuum lamination method

摘要

A vacuum lamination system and a vacuum lamination method are provided in which, when a laminate film and laminate base items are laminated and an excessive portion of the laminate film is cut from the laminated item having the laminate film laminated thereon, a high precision lamination is enabled and the cutting process including a conveying device for cutting the excessive portion of the laminate film can be simplified. In the vacuum lamination system, a laminate film and laminate base items that are conveyed on the carrier film are laminated by the batch type vacuum laminating device, and the laminate film is cut from the laminated item having the laminate film laminated thereon.

主权项

1. A vacuum lamination system comprising:
a batch type vacuum laminating device configured to laminate a laminate film and a laminate base item, which are conveyed on a lower carrier film, and the laminate film and the laminate base item are disposed in between the lower carrier film and an upper carrier film; a cutting stage comprising:
a roll configured for delaminating the upper carrier film which is disposed at a position where the upper carrier film is removed, and the lower carrier film is fed, anda wind-up roll configured for winding up the upper carrier film after removal of the upper carrier film, wherein the cutting stage is located where the lower carrier film is horizontally conveyed by a predetermined length beyond the position where the upper carrier film is removed; a cutting mechanism which is disposed over the cutting stage and includes a round-shape cutting blade or blade configured to move on a round-shape arc, the cutting mechanism further comprising a plurality of servomotors configured to raise and lower the cutting mechanism, and configured to move the cutting mechanism in the horizontal direction by detecting the laminate base item with a detection mechanism; and a film tension mechanism comprising a mounting plate which is disposed in a position lower than the lower carrier film at the cutting stage, wherein the mounting plate is configured to be raised higher than the fixed position of the lower carrier film to raise the lower carrier film to impart tension to the lower carrier film, wherein in a state in which the laminated item having the laminate film laminated thereon is mounted on the lower carrier film, the cutting mechanism is configured to cut an excessive portion of the laminate film from the laminated item having the laminate film laminated thereon, the laminate base item is a round-shape wafer and the laminate film is a continuous laminate film or a laminate film cut into a rectangle, and the cutting mechanism is configured to cut the laminate film in accordance with a shape of the laminate base item.