发明名称 Apparatus and method for cleaning semiconductor substrate using pressurized fluid
摘要 Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.
申请公布号 US8844546(B2) 申请公布日期 2014.09.30
申请号 US200812243685 申请日期 2008.10.01
申请人 Applied Materials, Inc. 发明人 Chen Hui (Fred);D'Ambra Allen L.
分类号 B08B3/00;H01L21/67 主分类号 B08B3/00
代理机构 Patterson & Sheridan, LLP 代理人 Patterson & Sheridan, LLP
主权项 1. A substrate cleaner, comprising: a chamber body defining a processing volume configured to receive a substrate in a substantially vertical orientation; a driving mechanism configured to support the substrate in a substantially vertical orientation and to rotate the substrate; a first spraying bar disposed in the processing volume and coupled to the chamber body; a second spraying bar disposed in the processing volume and coupled to the chamber body, wherein each of the first and second spraying bars has a plurality of nozzles formed therein and a front side and a back side of the substrate respectively; a water spraying bar disposed in the processing volume above the first spraying bar and coupled to the chamber body, wherein the water spraying bar has a plurality of water nozzles formed therein and is configured to spray the substrate; a pivoting arm disposed in the processing volume and having a first end coupled to the chamber body, wherein the pivoting arm pivots within a plane parallel to the substrate, and wherein the plane is positioned between the first and second spraying bars; a pivot arm nozzle coupled to a second end of the pivoting arm, wherein the pivoting arm is configured to move the pivot arm nozzle within the plane, and wherein the pivot arm nozzle is configured to direct a pressurized fluid towards at least a center of the substrate.
地址 Santa Clara CA US