Non-circular under bump metallization (UBM) structure, orientation of non-circular UBM structure and trace orientation to inhibit peeling and/or cracking

摘要

Some exemplary embodiments of this disclosure pertain to a semiconductor package that includes a packaging substrate, a die and a set of under bump metallization (UBM) structures coupled to the packaging substrate and the die. Each UBM structure has a non-circular cross-section along its respective lateral dimension. Each UBM structure includes a first narrower portion and a second wider portion. The first narrower portion has a first width. The second wider portion has a second width that is greater than the first width. Each UBM structure is oriented towards a particular region of the die such that the first narrower portion of the UBM structure is closer than the second wider portion of the UBM structure to the particular region of the die.

主权项

1. A semiconductor package comprising:
a packaging substrate; a die; and a set of under bump metallization (UBM) structures coupled to the packaging substrate and the die, wherein each UBM structure has a non-circular cross-section along its respective lateral dimension, each UBM structure includes a first narrower portion and a second wider portion, the first narrower portion having a first width, the second wider portion having a second width that is greater than the first width, each UBM structure oriented towards a particular region of the die such that the first narrower portion of the UBM structure is closer than the second wider portion of the UBM structure to the particular region of the die, wherein the second wider portion is distal to the particular region of the die relative to a center of the non-circular cross-section.