| 摘要 |
<p>THE PRESENT INVENTION RELATES TO AN EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, WHICH INCLUDES THE FOLLOWING COMPONENTS (A) TO (E): (A) A BIFUNCTIONAL EPOXY RESIN, (B) A CURING AGENT, (C) AN IMIDAZOLE COMPOUND REPRESENTED BY THE FORMULA (1), IN WHICH R1 AND R2 EACH INDEPENDENTLY REPRESENT AN ALKYL GROUP OR AN ALKYLOL GROUP,IN WHICH AT LEAST ONE OF R1 AND R2 REPRESENTS AN ALKYLOL GROUP, AND R3 REPRESENTS AN ALKYL GROUP OR AN ARYL GROUP, (D) A LINEAR SATURATED CARBOXYLIC ACID HAVING A NUMBER AVERAGE MOLECULAR WEIGHT OF 550 TO 800, AND (E) AN INORGANIC FILLER.</p> |
