Removing conductive material to form conductive features in a substrate

摘要

Apparatuses having, and methods for forming, conductive features are described. A hole is formed in a substrate and a conductive material is deposited in the hole. A part of the conductive material that occupies a first lengthwise portion of the hole is removed, and a conductive feature that occupies a second lengthwise portion of the hole remains in the substrate.

主权项

1. A method, comprising:
forming a hole in a substrate; depositing a conductive material into the hole; and removing a part of the conductive material that occupies a first lengthwise portion of the hole, such that at least one conductive feature that occupies a second lengthwise portion of the hole remains in the substrate, wherein
the hole includes a plurality of grooves on an outer edge of the hole,each of the plurality of grooves traverses a vertical dimension of the hole,the removing the part of the conductive material includes removing the part of the conductive material such that a plurality of conductive features are correspondingly disposed at least partially in the plurality of grooves, andthe plurality of conductive features are physically separate from each other.