| 发明名称 | Systems and methods for cleaving a bonded wafer pair | ||
| 摘要 | Systems and methods are provided for mechanically cleaving a bonded wafer pair by controlling the rate of cleaving. This controlled rate of cleaving results in a reduction or elimination of non-uniform thickness variations in the cleaved surface of the resulting SOI wafer. One embodiment uses flexible chucks attached to the faces of the wafers and actuators attached to the flexible chucks to cleave the bonded wafer pair. Other embodiments also use rollers in contact with the surfaces to control the rate of cleaving. | ||
| 申请公布号 | US8845859(B2) | 申请公布日期 | 2014.09.30 |
| 申请号 | US201213417934 | 申请日期 | 2012.03.12 |
| 申请人 | SunEdison Semiconductor Limited (UEN201334164H) | 发明人 | Ries Michael John;Libbert Jeffrey L.;Witte Dale A. |
| 分类号 | B32B38/10;H01L21/762;H01L21/67 | 主分类号 | B32B38/10 |
| 代理机构 | Armstrong Teasdale LLP | 代理人 | Armstrong Teasdale LLP |
| 主权项 | 1. A system for cleaving a bonded wafer pair having a first face and a second face, the system comprising: a flexible chuck comprising a flexible plate and a flexible wafer support having a first surface for attachment to the first face of the wafer pair and an opposing second surface for attachment to a first surface of the flexible plate; and an actuator attached to the flexible chuck for application of force on the flexible chuck, the application of force on the flexible chuck causing the cleaving of the bonded wafer pair. | ||
| 地址 | Singapore SG | ||