发明名称 |
Structure and method to fabricate tooling for bumping thin flex circuits |
摘要 |
A structure and method for a post plate of a die set that can be used to emboss a plurality of contact pads of a flexible printed circuit during the formation of a printer printhead. In one embodiment, a plurality of post plate posts can be formed, where each post plate post has a flat upper surface, generally straight sides, and a sharp corner where the flat upper surface and the generally straight sides intersect. Each post can be polished using, for example, a pad and an abrasive polishing compound or an electrochemical polishing process, to round the sharp corners to form a post having a rounded contour. In another embodiment, a plurality of post plate posts each having a rounded contour can be formed using a molding process. |
申请公布号 |
US8845907(B2) |
申请公布日期 |
2014.09.30 |
申请号 |
US201213721896 |
申请日期 |
2012.12.20 |
申请人 |
Xerox Corporation |
发明人 |
Nystrom Peter J.;Dolan Bryan R.;Redding Gary D. |
分类号 |
C25F3/00;B41J29/00 |
主分类号 |
C25F3/00 |
代理机构 |
MH2 Technology Law Group LLP |
代理人 |
MH2 Technology Law Group LLP |
主权项 |
1. A method for forming a post plate for embossing a printhead flexible printed circuit, comprising:
anisotropically etching a post plate blank to form a plurality of posts each having a square or rectangular cross section, a flat upper surface, generally straight sides, and sharp corners where the flat upper surface and the generally straight sides intersect; and polishing the plurality of posts to round the sharp corners and to form a plurality of polished posts each having a rounded contour. |
地址 |
Norwalk CT US |