| 摘要 |
Suggested are an apparatus which includes a substrate, a housing, and a load connection part and a connection element for sub connection parts, and an encapsulated power semiconductor module for the same apparatus. In this case, the substrate has a metal base plate. An insulator includes a conductor track and at least one power semiconductor component arranged in the upper surface. The inner connection element of a module is arranged on the main surface of the base plate which faces the inner part of the module. Also, the housing is made of an encapsulated material and is connected to the substrate by a first elastic connection unit with an encapsulation method. In this case, the load connection element and the sub connection element protrude from the power circuit of the substrate to the outside through the housing. A protrusion hole is encapsulated. |
