Co-support component and microelectronic assembly

摘要

A component is configured for connection with a microelectronic assembly having terminals and a microelectronic element connected with the terminals. The component includes a support structure bearing conductors configured to carry command and address information, and a plurality of contacts coupled to the conductors and configured for connection with the terminals. The contacts have address and command information assignments arranged in a first predetermined arrangement for connection with a first type of microelectronic assembly in which the microelectronic element is configured to sample command and address information coupled thereto through the contacts at a first sampling rate, and in a second predetermined arrangement for connection with a second type of microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the contacts at a second sampling rate greater than the first sampling rate.

主权项

1. A component for connection with a microelectronic assembly which includes a set of terminals and a microelectronic element having a memory storage array having a given number of storage locations, the microelectronic element of the assembly having inputs connected with the terminals for receiving command and address information specifying one of the storage locations, the component comprising:
a support structure bearing a set of conductors configured to carry the command and address information; and a plurality of contacts coupled to the set of conductors, the contacts configured for connection with corresponding ones of the terminals of the microelectronic assembly, wherein the contacts have address and command information assignments arranged in (a) a first predetermined arrangement for connection with a first type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through the contacts at a first sampling rate, the contacts having a first number thereof, and in (b) a second predetermined arrangement for connection with a second type of the microelectronic assembly in which the microelectronic element is configured to sample the command and address information coupled thereto through a subset of the contacts including a second number of the contacts at a second sampling rate being greater than the first sampling rate, the subset including some contacts occupying identical positions with the contacts that are assigned to the first predetermined arrangement, the second number being fewer than the first number.