Heat sink for an electronic or electrical component

摘要

The invention relates to a heat sink (1) for an electronic or electrical component, including: a base element (2) including a first main surface (2a) suitable for receiving the electronic component in close thermal contact; a plurality of elongate fins (3) projecting outwards from the second main surface (2b) of the base element (2), opposite the first surface (2a), and arranged around the entire periphery of the case element with enough space between fins to allow air circulation, characterized in that said space can be obtained by cutting a star-shaped geometrical shape matching said base element and said fins in a thin plate; and folding the fins relative to the plane of the base element.

主权项

1. Heat sink for an electronic or electrical component, comprising:
a base element comprising a first main surface suitable for receiving the electronic or electrical component in close thermal contact; a plurality of elongate fins projecting outwards from a second main surface of the base element, opposite the first surface, and arranged around the entire periphery of the base element with enough space between fins to allow air circulation, characterised in that: the fins being further arranged according to at least two concentric regular geometric figures with the main surfaces of the fins being secant or substantially tangent with respect to said geometric figures; the fins have a trapezoidal shape with a long side and a short side, wherein the short side of the fins are in contact with said base element; and in that said base element and said fins being formed from a thin plate having a cut in the form of a geometric shape corresponding to said base element and said fins; and
the fins are bent relative to the plane of the base element.