发明名称 |
Surface-mountable magnetic field sensor having a semiconductor chip and method for producing a circuit board having a magnetic field sensor |
摘要 |
A surface-mountable magnetic field sensor (1) with a semiconductor chip (4), a magnetic field measuring device (30), and in a method for producing and populating a circuit board (24) having a magnetic field sensor (1), the magnetic field sensor (1) has a semiconductor chip (4), which is arranged on a flat-conductor substrate (5). At least three flat-conductor electrodes (6 to 9), which protrude out of a plastic housing side (10), are electrically connected to the semiconductor chip (4). The flat-conductor substrate (5) and the semiconductor chip (4) are embedded in a plastic housing (11). The plastic housing (11) can be inserted with the embedded semiconductor chip (4) into a magnetic field gap (12), with the flat-conductor electrodes (6 to 9) protruding, wherein the flat-conductor electrodes (6 to 9) have bends (13 to 16) at a distance from the plastic housing side (10), the bends being surface-mountable on a circuit board. |
申请公布号 |
US8847590(B2) |
申请公布日期 |
2014.09.30 |
申请号 |
US201013255994 |
申请日期 |
2010.03.05 |
申请人 |
Conti Temic Microelectronic GmbH |
发明人 |
Flock Stefan;Krella Uwe;Steger Jürgen |
分类号 |
G01R33/07;G01R33/00;G01R33/09 |
主分类号 |
G01R33/07 |
代理机构 |
King & Spalding L.L.P. |
代理人 |
King & Spalding L.L.P. |
主权项 |
1. A surface-mountable magnetic field sensor comprising:
a semiconductor chip on a flat-conductor substrate, and at least three flat-conductor electrodes protruding from a plastic housing, wherein the semiconductor chip and the flat-conductor substrate are embedded into the plastic housing, wherein the plastic housing can be inserted with the embedded semiconductor chip into a magnetic field gap, with the flat-conductor electrodes protruding, and wherein each of the at least three flat-conductor electrodes has a protruding portion protruding from a plastic housing, a lateral portion extending laterally to the protruding portion, and a bent section connecting the lateral portion and protruding portion, wherein the bent sections of the flat-conductor electrodes are arranged in a plastic holder, and the lateral portions of the flat-conductor electrodes extend from the plastic holder in different directions, and wherein the lateral sections of the flat-conductor electrodes are surface-mountable on a circuit board when the plastic holder is inserted through an opening in the circuit board. |
地址 |
Nurnberg DE |