发明名称 |
Method for forming biochips and biochips with non-organic landings for improved thermal budget |
摘要 |
The present disclosure provides biochips and methods of fabricating biochips. The method includes combining three portions: a transparent substrate, a first substrate with microfluidic channels therein, and a second substrate. Through-holes for inlet and outlet are formed in the transparent substrate or the second substrate. Various non-organic landings with support medium for bio-materials to attach are formed on the first substrate and the second substrate before they are combined. In other embodiments, the microfluidic channel is formed of an adhesion layer between a transparent substrate and a second substrate with landings on the substrates. |
申请公布号 |
US8846416(B1) |
申请公布日期 |
2014.09.30 |
申请号 |
US201313801182 |
申请日期 |
2013.03.13 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chu Chia-Hua;Chang Allen Timothy;Chen Ching-Ray;Chang Yi-Hsien;Liu Yi-Shao;Cheng Chun-Ren;Cheng Chun-Wen |
分类号 |
H01L21/00;G01N33/543 |
主分类号 |
H01L21/00 |
代理机构 |
Slater and Matsil, L.L.P. |
代理人 |
Slater and Matsil, L.L.P. |
主权项 |
1. A method of manufacturing a biochip, comprising:
forming a plurality of first landings on a first substrate; depositing a passivating layer over and between the plurality of first landings on the first substrate; depositing and planarizing an oxide layer over the passivating layer on the first substrate; fusion bonding the oxide layer on the first substrate to a transparent substrate; etching a backside of the first substrate in a pattern to expose some of the plurality of first landings; forming a plurality of second landings on a second substrate; depositing a protective layer over the plurality of second landings on the second substrate; forming through-holes in the second substrate or the transparent substrate; removing the protective layer; and fusion bonding the first substrate and the second substrate. |
地址 |
Hsin-Chu TW |