摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation without adding components.SOLUTION: A back light 12 comprises a long flexible wiring board 26 on which a plurality of light emitting components 22 are mounted and whose first side end 30 and second side end 32 located at both ends in the direction of the width thereof extend in the direction of the length thereof. A plurality of light emitting components 22 are arranged on the flexible wiring substrate 26 so as to be lined up in the direction of the length thereof, displaced toward the second side end 32 in the width direction thereof, with light emitting faces 24 facing toward the first side end 30. The flexible wiring substrate 26 is a multi-layer substrate and has wiring patterns 36 in two or more layers. The wiring patterns 36 in the layers include the wiring pattern 36H in the uppermost layer jointed to the plurality of light emitting components 22. The wiring pattern 36H in the uppermost layer is pulled out in the direction of the length of the flexible wiring substrate 26 from an area overlapping the corresponding light emitting component 22, and also has a portion pulled out further forward than the corresponding light emitting face 24, on the first side end 30 side. |