LEAD FRAME FOR MOUNTING SEMICONDUCTOR ELEMENT, AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a lead frame for mounting a semiconductor element satisfying adhesion between the mounting part and the terminal part of the semiconductor element and a sealing resin.SOLUTION: On the side face of the semiconductor element mounting part and/or the terminal part of the lead frame, a protrusion part 4 protruding from the top and the bottom face of the semiconductor element mounting part and/or the terminal part is included. A tip part 5 of the protrusion part 4 is substantially flat or of an arcuate shape with a large thickness.