| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid processing apparatus capable of cleansing a rear side of a substrate and a cup body in well.SOLUTION: A liquid processing apparatus comprises a spin chuck 11, around which a cup body 2 is provided, for rotating a wafer W to process the wafer with liquid. The liquid processing apparatus further comprises a cleaning material 3 supported around a vertical axis, and movable up and down against a cleaning nozzle 8. The cleaning material 3 is also rotatable at a position of cleaning the cup body 2. To clean a rear face of the wafer W, the cleaning material 3 is set at a first position, and cleaning liquid from the cleaning nozzle 8 is led through an opening 52 of the cleaning material 3 and reaches on the rear face of the wafer W. To clean the cup body 2, the cleaning material 3 is set at a second position higher than the first position, and cleaning liquid from the cleaning nozzle 8 is hit on an annular part 5 of the cleaning material 3 so as to be guided to an inside of the cup body 2. Accordingly, the rear face of the wafer W and the cup body 2 can be cleaned successfully. |
