| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module having the enhanced adhesiveness between a mold resin and an electromagnetic wave shield.SOLUTION: An electronic component module comprises: a module substrate 20; electronic components 31 to 33 mounted on a main surface 21 of the module substrate 20; a mold resin 40 formed on the main surface 21 of the module substrate 20 so as to cover electronic components 31 to 33 and having surfaces 41, 42 treated with roughening process; and an electromagnetic wave shield 50 formed on surfaces 41, 42 of the mold resin 40. According to the present invention, since surfaces 41, 42 of the mold resin 40 are treated with roughening process, adhesiveness between the mold resin 40 and the electromagnetic shield 50 can be enhanced. |
