SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can reduce a time for removing a resin without damaging a constituent component.SOLUTION: A semiconductor device manufacturing method comprises a resin removal process of causing a condenser lens 60 to condense laser beams L having a wavelength at which a resin 20 has an absorption ratio of the laser beams L larger than that of a constituent component 10. In a region formed by the laser beams L which passed the condenser lens 60, when assuming that a region having energy that damages the constituent component 10 is a first region L1 and a region having energy smaller than the energy of the first region L1 is a second region L2, irradiation on the first region L1 is performed only on the resin 20 to remove the resin 20.