| 摘要 |
PROBLEM TO BE SOLVED: To heighten cooling efficiency as whole of a plurality of electronic devices to be cooled.SOLUTION: An electronic device cooling system includes: a first surface and first reverse side cooling flow path passing through the surface and reverse side of a first electronic device to be cooled; a second surface and second reverse side cooling flow path passing through the surface and reverse sides of a second electronic device to be cooled; a first connection flow path for connecting the outlet side of the first surface cooling flow path to the inlet side of the second reverse side cooling flow path; a second connection flow path for connecting the outlet side of the first reverse side cooling flow path to the inlet side of the second reverse side cooling flow path; a third connection flow path for connecting the outlet side of the first surface cooling flow path to the inlet side of the second surface cooling flow path; a fourth connection flow path for connecting the outlet side of the first reverse side cooling flow path to the inlet side of the second surface cooling flow path; a shielding member for varying a state of communication between the first, second, third and fourth connection flow paths and the second surface cooling flow path and second reverse side cooling flow path; and an actuator connected to the shielding member and driven according to temperature difference between the first and the second connection flow paths. |
