| 摘要 |
PURPOSE: A semiconductor package structure and a manufacturing method thereof are provided to reduce manufacturing costs by manufacturing the semiconductor package structure without under bump metallurgy. CONSTITUTION: A semiconductor wafer is prepared (S10). A first metal layer is formed on a connection pad (S15). An insulation layer is formed on the first metal layer (S20). A guide hole and a positioning structure are formed (S25). Each semiconductor die is divided according to a semiconductor wafer (S30). The semiconductor die is inserted into a spacer (S35). A second metal layer is formed on the surfaces of the insulation layer and an insulation plate (S40). A circuit layer is formed by designing the second metal layer (S45). [Reference numerals] (S10) Semiconductor wafer is prepared; (S15) First metal layer is formed; (S20,S51) Insulation layer is formed; (S25) Guide hole and a positioning structure are formed; (S30) Division; (S35) Arrangement and insertion; (S40) Second metal layer is formed; (S45) Circuit is formed; (S53) Guide hole is formed; (S55) Outer circuit is formed; (S60) Bump is connected |
