发明名称 HEAT CONDUCTION STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat conduction structure in which a plurality of batteries of a battery module are coupled.SOLUTION: The heat conduction structure includes at least a heat conduction plate set. The heat conduction plate set has a plurality of heat conduction plates. Each heat conduction plate includes a base plate. The base plate has a plurality of through-holes. The heat conduction plates are mutually stacked. Through-holes of the heat conduction plates are mutually correspond and form a plurality of channels. Batteries are inserted in the channels.</p>
申请公布号 JP2014183044(A) 申请公布日期 2014.09.29
申请号 JP20140044898 申请日期 2014.03.07
申请人 SIMPLO TECHNOLOGY CO LTD 发明人 LI WENZAO;GUO KUNYU;CHEN MINYAN;LEE CHENG-CHIH;LIN YU-JU
分类号 H01M10/6555;H01M2/02;H01M2/10;H01M10/613;H01M10/615;H01M10/617 主分类号 H01M10/6555
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