发明名称 EVAPORATION SOURCE, AND VACUUM VAPOR DEPOSITION APPARATUS USING THE EVAPORATION SOURCE
摘要 PROBLEM TO BE SOLVED: To provide an evaporation source and a vacuum vapor deposition apparatus which are capable of increasing the degree of freedom in layout of a nozzle and a lid, or capable of preventing nozzle clogging caused by a vapor deposition material or fixation of the lid being a supply port of the vapor deposition material even in high-rate vapor deposition.SOLUTION: An evaporation source has: a crucible equipped with an opening used for inputting a vapor deposition material into a holding part which holds the vapor deposition material inside, a lid for closing the opening, a nozzle from which the vapor deposition material is discharged for a vapor deposition target, and a housing holding the lid and the nozzle; and heating means for heating the crucible. The heating means performs local heating to the crucible, by which a region having higher temperature than temperature at which the vapor deposition material condenses is formed in a region in the crucible closer to the nozzle, and a region having lower temperature than temperature at which the vapor deposition material condenses is formed in a region farther than the region having higher temperature from the nozzle, and the evaporation source has condensation means for condensing the vapor deposition material in the region having lower temperature.
申请公布号 JP2014181387(A) 申请公布日期 2014.09.29
申请号 JP20130057011 申请日期 2013.03.19
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 MATSUURA HIROYASU;MINEKAWA HIDEAKI;OGATA TOMOHIKO;MIYAKE TATSUYA;YAZAKI AKIO;IZAKI MAKOTO
分类号 C23C14/24 主分类号 C23C14/24
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