SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a laminated semiconductor device which can achieve excellent cutting surface and easy mounting and downsizing.SOLUTION: A semiconductor device manufacturing method comprises: a process of arranging and bonding on a first substrate 20, a plurality of semiconductor chips 11a in a first layer on the same plane; a process of laminating at least one layer of semiconductor chips 11b-11h on respective semiconductor chips 11a; a process of cutting the first substrate 20 to separate the first substrate 20 into chip laminates 10; a process of temporarily connecting each electrode pad part formed on a surface of each chip laminate 10 so as to match an electrode pad part of a second substrate 30 in an aligned and opposed manner; a process of completely reflowing the second substrate 30 and the chip laminate 10 to electrically connect the electrode pad parts with each other; a process of supplying a liquid resin (encapsulation resin 40) from the first substrate side of the chip laminate 10 along the laminate to resin encapsulate each gap between semiconductor chips, and each gap between the chip laminate 10 and the second substrate 30; and a process of cutting the chip laminate 10 from the second substrate 30 side by a dicing blade to singulate the chip laminate 10.