| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor element, in which an electrode layer is made thick so as to improve adhesiveness between the electrode layer and a resin and the electrode layer is formed into an inverted trapezoid in a cross-sectional view so as to allow the electrode layer to bite into the resin.SOLUTION: The substrate for mounting a semiconductor element is manufactured through the following steps: a step of forming a plurality of resist layers 10, 11 on a surface of a substrate 1 by using two types of dry film resists having different main photosensitive wavelengths; a first exposure step of exposing only a specific resist layer 10 in the plurality of resist layers to light from above the layers by using a first exposure mask 20 so as to form a first pattern; a second exposure step of exposing another resist layer 11 in the plurality of resist layers to light from above the resist layers by using a second exposure mask 21 so as to form a second pattern; a developing step of removing unexposed portions 30, 31 of the plurality of resist layers so as to partially expose the surface of the substrate to form resist masks 10, 11 having openings 40, 41; a step of forming a plating layer 2 by subjecting the exposed surface of the substrate to desired plating; and a step of removing the resist masks. |
