发明名称 IC CARD SUBSTRATE, IC CARD MANUFACTURING METHOD AND IC CARD
摘要 PROBLEM TO BE SOLVED: To provide a more convenient IC card substrate, an IC card manufacturing method and an IC card.SOLUTION: The IC card substrate to which an IC module with an IC chip and a contact pattern is attached includes a main body, an antenna embedded in the main body, a recess for fixing the IC module to the main body and a contact terminal connected to the antenna, being positioned at a location where it comes into contact with the contact pattern when the IC module is engaged with the recess.
申请公布号 JP2014182644(A) 申请公布日期 2014.09.29
申请号 JP20130057276 申请日期 2013.03.19
申请人 TOSHIBA CORP 发明人 NOZAKI MASAHIRO
分类号 G06K19/077;G06K19/07 主分类号 G06K19/077
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