| 摘要 |
The present invention discloses a method for packaging a quad flat non-leaded package body, and a package body, and pertains to the field of packaging technologies. The method includes: etching an upper surface of a metal plate to process a desired groove and form a bond wire bench, a component bench, and a bump; processing the bump to reach a preset height, assembling a component on the component bench, and connecting the component and the bond wire bench; packaging the processed metal plate in plastic to form a package body, and exposing the surface of the processed bump on an upper surface of the package body to form a top lead; and etching a lower surface of the package body to process a desired bottom lead and obtain a quad flat non-leaded package body. In the present invention, a QFN package body with a top lead is formed, and therefore, large passive components can be stacked on the QFN package body while the high electrical performance and heat dissipation performance of the QFN package are exerted; the structure of the package body is simplified while the reliability of internal and external welding joints is improved; in addition, a plurality of components can be stacked through the top lead to overcome the limitations of component stacking. |
