发明名称 |
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To instantly dry a liquid on a surface of a substrate when the substrate is dried and maintain cleanliness of front and rear surfaces of the substrate after cleaning and drying.SOLUTION: In a substrate processing apparatus 10, a substrate processing chamber 40 comprises: a cleaning fluid supply section 47 which supplies a cleaning fluid onto a surface of the substrate W; a solvent supply section 48 which replaces the cleaning fluid on the surface of the substrate W with a volatile solvent; heating means 51 which heats the substrate W to which the volatile solvent is supplied; and dry means that eliminates liquid balls generated by the volatile solvent on the surface of the substrate W through heating action of the heating means 51 to dry the surface of the substrate W. The substrate processing apparatus 10 further includes cooling means which cools the substrate dried by the dry means. |
申请公布号 |
JP2014183063(A) |
申请公布日期 |
2014.09.29 |
申请号 |
JP20130054573 |
申请日期 |
2013.03.18 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
HAYASHI KONOSUKE;FURUYA MASAAKI;OTAGAKI TAKASHI;NAGASHIMA YUJI;KONASE ATSUSHI;ABE MASAYASU |
分类号 |
H01L21/304;H01L21/677 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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