| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet-like high-temperature solder joint material which can suppress generation of a void, and can form a junction part with excellent reliability, and provide a die bonding method using the same.SOLUTION: A sheet-like high-temperature solder joint part 1 has a structure which is easy to tightly adhere an Sn solder 3 on front and rear surfaces of a metal foil 2c by using the metal foil 2c having the flat front and rear surfaces, and covering the front and rear surfaces of the metal foil 2c with the Sn solder 3. Thus, a gap and an oxide film which cause generation of a void between the metal foil 2c and the Sn solder 3 can be prevented from being generated. The metal foil 2c is structured of at least one of Cu, Ni, Ag, and Cu alloy which generates an intermetallic compound by reaction with Sn. The sheet-like high-temperature joint material 1 is interposed between the semiconductor element 6 and the substrate 7, and the intermetallic compound is formed by reacting the Sn in the Sn solder 3 with metal in the metal foil 2c. The semiconductor element 6 is die-bonded to the substrate 7 by the sheet-like high-temperature solder joint material 1. |
