| 摘要 |
PROBLEM TO BE SOLVED: To provide a member for a semiconductor manufacturing device in which a ceramic component and a metal component are bonded through a thermosetting sheet, and which can sufficiently endures use in high temperatures.SOLUTION: In a member 10 for a semiconductor manufacturing device, an electrostatic chuck 12 made of alumina and a cooling plate 14 made of aluminum are bonded through a thermosetting sheet 16. The thermosetting sheet 16 is one obtained by curing an epoxy-acryl mixed adhesive. The adhesive contains (A) a hydrogen transfer type epoxy resin allowing poly-addition, (B) a polymer of acrylic acid ester and methacrylate ester, and (C) a curing agent. |
