| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate capable of suppressing a level difference large enough to possibly interrupt high density mounting of a semiconductor device and the like and capable of enhancing plating resistance to a resistive body, and to provide a process of manufacturing the same.SOLUTION: A surface of a protective paste 12a that covers a resistive body paste pattern 11a formed on a substrate sheet 1a is made to be in a same plane as a surface of the substrate sheet 1a and is calcinated. The protective paste 12a contains a silicon oxide, a boron oxide, a calcium oxide, and an aluminum oxide.</p> |
