A TRAY FOR ALIGNING THE POSITIONS OF SEMICONDUCTOR PACKAGE, TEST HANDLER USING THE SAME, A METHOD FOR ALIGNING THE POSITIONS OF SEMICONDUCTOR PACKAGE AND THE TEST METHOD USING THE SAME

摘要

Disclosed are a tray for aligning a semiconductor package, a test handler using the same, a method of aligning a semiconductor package, and a test method using the same. According to the present invention, the tray for aligning a semiconductor package comprises: a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages is individually received; and an air position-aligning unit coupled to the tray main body. The air position-aligning unit applies air having a preset pressure to the semiconductor package received at the package pocket portion. Therefore, the semiconductor package is aligned at the package pocket portion.