| 摘要 |
The present invention relates to a resin molding apparatus for electronic components and a method thereof, which can change the flatness of a mold frame through thermal deformation rate by closely coupling a plurality of heating plates to the mold frame, and respectively, thermal controlling them. The resin molding apparatus for electronic components in the present invention comprises: an upper body; a lower body which performs mold closing with the upper body to pressure mold electronic components at a high temperature; and a micro control unit which changes the flatness of the upper body or the lower body by using thermal expansivity. |
