| 摘要 |
FIELD: electricity.SUBSTANCE: wiring is formed from alloy containing nickel 2.2-2.8 %, silicon 0.5-0.9 %, chrome 0.4-1.0 %, zirconium 0.05-0.25 %, magnesium 0.05-0.25 %, nanodispersed fulleroid material 0.0001-0.5 %, copper - other by hot forming. First the preform is exposes to preliminary tempering by holding it at the temperature 800-1000°C during 15 minutes - 2 hours at a rate of cooling less than 30°C/s and before forming it is heated to the temperature 900-950°C. After hot forming the obtained product is exposed to tempering by a gradual heating within 2.5 hours to the temperature 900°C, holding it at this temperature no less than 40 minutes and cooling in water. Then the obtained form is exposed to forced aging, for this purpose it is gradually heated within 1.5 hours up to the temperature 495±2°C and held at this temperature within 4 hours with consequent cooling in air.EFFECT: improvement of quality current-conducting connections at the expense of increase of electrical conductivity of current-carrying wires manufactured by hot forming from the copper-based alloy.2 cl |
